Wafers, dies, capacitors or SiP's (system-in-pakage) need to be prepared for the package solution and for easy handling on automated equipment. We offer pre-assembly such as wafer thinning, wafer dicing, die sorting or artificial wafer building.
For single and multi-chip for IC’s, capacitors and a broad range of other form factors we offer epoxy or Die Attach Film (DAF) based Die Attach. A range of qualified materials and processes combined with the creativity and workmanship of our engineers provide Die Attach solutions for a diverse range of products.
Thermosonic gold wire bonding is our versatile interconnection workhorse for all situations. Silver alloy wire is our solution for very cost sensitive markets. Depending on requirements we bond die to substrate, substrate to die, die to die or whatever is best suited within the constraints of the package.
Encapsulation requirements can range from simple low cost protection of dies and wires to an integrated part in the functional performance of the final product. We offer various liquid resin encapsulation processes as well as transfer molding.
Testing includes electrical and mechanical measurements to verify the form and function of the products according to agreed specifications. We do have standard specifications for the smart card market and provide tailor made specs or test development according to the requirements of your products.
By making use of tools for digital communication with your products we are able to provide a wide range of services like software/ patch loading and pre-personalization. Reading and processing data from the controllers allows us to verify e.g. the structure of UID, typically used for authenticity verification. Another application is UID white lists generation which is mandatory for certain security schemes.
