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Request MicroSON®-3 spec sheet 

Are you interested in MicroSON®-3 and would you like to receive the spec sheet? Please send us a message with information about your request and we will send you the spec sheet as soon as possible. 

MicroSON®-3 SMD package 

A Small Outline No-leads package, incorporating the latest generation UHF RFID chip. The MicroSON®-3 is a near chip scale plastic encapsulated package with a copper leadframe substrate.

Key benefits

  • Reliable performance under harsh conditions
  • Moisture Sensitivity Level 1 (MSL-1) qualified
  • Tailored to fit industrial application requirements 
  • RAIN compliant with the latest generation UHF Gen2v2 RFID chips
  • The possibility to package your application-specific RFID chip

Target applications

  • Ruggedized tag design
  • PCB Tagging and Tracking
  • Asset Management with high reliability requirements
  • Industrial Work In Progress tracking

Key features

  • Plastic extremely thin small outline package
  • No-leads, 3-terminals
  • Size 1.45 x 1.00 x 0.5 mm 
  • For surface-mount assembly 
  • Industrial (operating) temperature –40°C to +85°C
  • Storage temperature –55°C to +125°C

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