Our standard input format is sawn wafers on film frame. We can also handle waffle packs, JEDEC trays or artificially (re-)constructed wafers.
Epoxy die attach
We offer die attach with conductive and non-conductive epoxy, in-line snap curing as well as conventional batch curing. For the marking of rejected dies we can process wafer maps in various formats, inkdots or a mix of both.This allows us to process all the parts typically needed for low power applications.
Die Attach Film (DAF)
We can handle and process all types of conductive or non-conductive DAF. We can offer special requirements such as stacked dies, extremely tight bondline and positioning control.